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IV Self-adhesive Labels Congress – the largest event for the self-adhesive label industry in Poland

Participant registration is now open for the Self-adhesive Labels 2024 Congress. This time, narrow web printing specialists will meet on 15-16 April at Łochów Palace and Farm, some 80 km from Warsaw.

So far, the co-organisers of the fourth edition of Poland's largest event for the label and flexible packaging industry have been joined by: Api Foilmakers, Avery Dennison, Beontag, BOBST, Cicero Stapro Group, Digiprint, Digiprint PL, Excelitas Technologies, Flexcon, GEW Engineering UV, Heidelberg, Koenig & Bauer, PrintsPaul, SCORPIO. Partners were the companies: BST Group, Frimpeks, Laser Systems Intergrators, MultiSTiQ, tesa. Patronage of the congress is held by: the Polish Chamber of Printing, the Polish Chamber of Flexographers, the Polish Chamber of Packaging, the Polish Chamber of Packaging Recovery and Recycling, the Association of Polish Self-adhesive Label Manufacturers, and FINAT, the international association for the European label industry. The event, held as part of the Academy of Knowledge, is organised by Polski Drukarz sp. z o.o.

The congress will include the 19th “Self-adhesive labels - the latest technologies” conference. The lecture sessions will cover topics such as:

  • the latest EU legislative regulations related to sustainability (ROP, PPWR, SUP, deposit system), which will shape the label and packaging market in the coming years;
  • possibilities and ways to recycle labels;
  • efficient and precise mould assembly as a basis for production efficiency in the label printer;
  • the latest solutions for label production, both advanced flexographic and digital presses; complete production lines and peripheral equipment
  • innovative substrates for label production;
  • the advantages of UV LED curing in label printing;
  • successful implementations of label finishing technologies in printers;
  • the latest developments in automation and digitisation of both production preparation, printing and post-press processing.

The drupa trade fair is ahead of us, so also expect to hear what manufacturers and suppliers of label and flexible packaging solutions will be showing in Düsseldorf in late May/early June.

The Self-adhesive Labels 2024 Congress will traditionally be accompanied by a technological exhibition dedicated to this segment of printing and packaging production. As part of the exhibition, SCORPIO will present the Heaford FTS 700 plate mounting device and, in between lectures, Avery Dennison invites representatives of label printers to a workshop on “Requirements and considerations for labels in a closed loop economy” (pre-registration required).

The regulations and application form can be found at https://etykietysamoprzylepne.akademia-wiedzy.eu/. A detailed programme for the event will also be posted there soon. We are waiting for applications for participation until 22 March.