HomeNews › Avery and Gallus unveiled the new die-cutting technology
 
12-10-11
Member news news

Avery and Gallus unveiled the new die-cutting technology

Avery Dennison launched the new die-cutting technology, ThinStream which allows the die-cutting of labels with liner as thin as 12 microns.

This patented technology, ThinStream has been licensed to the Gallus Group, which has created the Gallus cold die-unit to accomplish this advanced die-cutting technology.

Anil Sharma, managing director, Avery Dennison India, said: "We wanted to combine our extensive material manufacturing expertise with technologies that allow us and our customers to further enhance label performance while also reducing liner waste and providing environmental and cost benefits."

Sharma added: "ThinStream is a proof that collaboration across key industry disciplines, places Avery Dennison and our partners at the center of a whole new wave of innovations in the label and packaging industry."

According to Avery Dennison, die-cutting with liner caliper below 23 microns was virtually impossible until the advent of ThinStream. With conventional kiss-cutting, the die can cut through the liner and cause operational and quality problems during converting and dispensing.

In the cold die process, the facestock is delaminated from the liner before cutting. The face material is then chilled abruptly to -22° C or lower and then cut with a solid or flexible rotary die. The materials are then re-laminated within milliseconds.

Source: Printweek.com, by Sachin Shardul Wednesday, 12 October 2011